AIM Solder 8152
Epoxy 4089, Bonding SMT Components to aPWB, 10cc Syringe, Dispensing Apps
Mfr. Part #: 8152 / RS Stock #: 70054295
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Product Specifications
Product Attribute
Attribute Value
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Adhesive Type
Epoxy
Boiling Point
>260°C °C
Color
Yellow
Dispensing Method
Syringe
Elongation
0.046 %
Odor
Aromatic (slightly)
Physical State
Paste
Setting Time
Time from ambient to 75°C — 30 seconds, From 75°C to 100°C — 30 seconds, From 100°C to Peak 120°C — 60 seconds min
Size
10 cc
Tensile Strength
11500 psi N
Type
Epoxy Adhesive
Viscosity
300-500 kcps
Overview
Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4089 are adequate for use with high speed placement equipment.
Features
For Printing and Dispensing Applications
One Part Epoxy
Good for High Speed PlacementEquipment
Fast Curing
Non-Stringing Formula
High Shear Strength
Features
For Printing and Dispensing Applications
One Part Epoxy
Good for High Speed PlacementEquipment
Fast Curing
Non-Stringing Formula
High Shear Strength