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TE Connectivity 2-641609-1

TE Connectivity - 2-641609-1 - Socket,  DIP;  Dual Leaf;  14 Pos.;  0.100In.cen.;  Thru Hole;  0.310In.;  Ber. Copper;  Tin View larger image View larger image
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TE Connectivity Socket, DIP; Dual Leaf; 14 Pos.; 0.100In.cen.; Thru Hole; 0.310In.; Ber. Copper; Tin
Mfr. Part#:

Allied Stock#: 70084222

 RoHS Compliant Part

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Agency Approvals: UL, CSA
Angle: Straight
Brand/Series: DIPLOMATE Series
Centerline: 0.100
Contact Plating: Gold
Flammability Rating: UL 94 V-0
Frame Type: Ladder
Length, Terminal Post: 0.12 in.
Material, Body: Thermoplastic
Material, Contact: Beryllium Copper
Number of Contacts: 14
Number of Positions: 14
Pin Spacing: 0.1" (2.54mm)
Plating, Contact Mating Area: Tin
Primary Type: DIP
Row Spacing: 0.31" (7.9mm)
Spacing, Row to Row: 0.310 in.
Standards: RoHS, ELV Compliants, UL 94V-0 (Housing Flammability Rating)
Temperature, Operating: 105 °C
Termination: Thru-Hole


DIP IC Socket, 14 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range

  • Solder Tail Dual Leaf (DL) Sockets
  • Dual Wiping Contacts
  • Face Wipe Contacts for High Reliability and Constant, Low Resistance
  • Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
  • Housing Standoffs and Slots Facilitate Board Cleaning
  • Retention Style Tails or Straight Solder Tails
  • Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
  • Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
  • Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating