TE Connectivity 2-641609-1

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Socket; DIP; Dual Leaf; 14 Pos.; 0.100In.cen.; Thru Hole; 0.310In.; Ber. Copper; Tin
Mfr. Part#: 2-641609-1
Allied Stock#: 70084222

RoHS Compliant Part

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Datasheet

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Minimum Quantity: 1

Multiples Of: 1

Specifications

Agency Approvals : UL, CSA
Angle : Straight
Centerline : 0.100
Contact Plating : Gold
Frame Type : Ladder
Length, Terminal Post : 0.12 in.
Material, Body : Thermoplastic
Material, Contact : Beryllium Copper
Number of Contacts : 14
Number of Positions : 14
Pin Spacing : 0.1" (2.54mm)
Plating, Contact Mating Area : Tin
Primary Type : DIP
Product Header : Vertically Mounted DIP Socket
Row Spacing : 0.31" (7.9mm)
Series : DIPLOMATE Series
Spacing, Row to Row : 0.310 in.
Standards : RoHS, ELV Compliants, UL 94V-0 (Housing Flammability Rating)
Temperature, Operating : 105 °C
Termination : Thru-Hole

Overview

DIP IC Socket, 14 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range

  • Solder Tail Dual Leaf (DL) Sockets
  • Dual Wiping Contacts
  • Face Wipe Contacts for High Reliability and Constant, Low Resistance
  • Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
  • Housing Standoffs and Slots Facilitate Board Cleaning
  • Retention Style Tails or Straight Solder Tails
  • Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
  • Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
  • Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

  • Product Added to Cart
    TE Connectivity
    Socket; DIP; Dual Leaf; 14 Pos.; 0.100In.cen.; Thru Hole; 0.310In.; Ber. Copper; Tin
    Allied Stock #: 70084222
    Mfr's Part #: 2-641609-1
    $0.270 Each
    Quantity added: