Protektive Pak 47028
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Removal leaves little or no residue
Masking off PCBs for IR reflow ovens or wave soldering under 572°F (300°C) ~ 10 seconds
Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
Low sloughing plastic core
Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
For best results, apply to board using a rubber roller
1.0 mil thick (0.0254 mm) polyimide film (DuPont® Kapton or equivalent)
1.4 mil thick (0.0356 mm) conductive polysiloxide adhesive
Adhesive surface resistivity 10E3 to 10E4 ohms
Max temperature 300°C (572°F), 10 seconds
Lead-free RoHS compliant