Ohmite DV-T263-101E-TR
TO-263 HEAT SINK / KAPTON TAPE
Mfr. Part #: DV-T263-101E-TR / RS Stock #: 70584117
Price
Qty.
Standard Price
250
$2.06
Additional Inventory
Manufacturer Lead Time:
18 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Finish
Degreased
For Use With
TO-263
Material
Aluminum Alloy
Special Features
Increased Surface Areas By 3 Times Therefore Thermal Performance Up To 300% Over The Aluminum Stamped Heat Sinks On Markets ; Light Weight Aluminum Construction Allows Faster Pick And Place Assembly Reducing The Manufacturing Cycle Time ; Radius Mounted “Rollers” Are Designed For Maximizing Heat Transfer From The Component And Avoiding The Thermal “bottle-neck” Seen In Stamped And Staked Heatsinks ; Available In Tape And Reel (200 Or 250 Based On Part Series) ; RoHS Compliant
Thermal Resistance
8 °C/W W/m2C
Weight
3.8 g
Overview
Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. These rods (or "rollers") are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263 and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal "bottleneck" is also eliminated, while surface area for cooling is maximized with the extruded fins of the D Series body.
