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NTE Electronics, Inc. TP0010

NTE Electronics, Inc. - TP0010 - Theremo Pad;  0.50C/W Thermal Resistance;  Silicon/Fibre Glass;  Gray View larger image View larger image
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NTE Electronics, Inc. Theremo Pad; 0.50C/W Thermal Resistance; Silicon/Fibre Glass; Gray
Mfr. Part#:
TP0010

Allied Stock#: 70215881

 RoHS Compliant Part

 
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Pricing (USD) & Availability
Standard Pricing
$2.26 (Pack of 5)
1$2.260
50$2.080
100$1.920
250$1.780
Availability

98 can ship immediately.

105 on order.

Request Lead Time

Minimum Quantity: 1 |  Multiples Of: 1

Specifications

Brand/Series: TP Series
Color: Gray
Dielectric Constant: 5.5
Dimensions: 1.03 L x 0.81 W In.
Hardness: 85 Shore A
Material: Silicone/Fiberglass
Package Type: TO-3PML
Temperature, Continuous Use: -60 to 180 °C
Thermal Conductivity: 0.9 W/m-K
Thickness: 0.009 In.
Type: Thermal Pads
Voltage, Breakdown: 4500 VAC

Overview

NTE's THERMO-PADS do away with the old fashioned and messy mica wafer and conductive grease method of mounting power semiconductors. These thermally conductive insulators offer low heat transfer resistance while still providing high electrical isolation between the parts of the assembly. The elastomeric material combines the electrical isolation of rigid insulators with the ability to conform to rough surfaces and reduce contact resistance in much the same manner as thermal greases. Proper selection and use of these thermo-pads results in a securely mounted power semiconductor and minimum resistance to the heat transfer between it and the heat sink. Typical Properties Color: Gray; Test Method — Visual. Breaking Strength, Lbs./Inch: 100; Test Method — ASTM D 1458. Elongation, Percent: 4; Test Method — ASTM D 412. Volume Resistance Ohm Metre Minimum Normal: 1.0 × 1013, Test Method — ASTM D 257. Volume Resistance Ohm Metre Minimum Moist: 1.5 × 1010, Test Method — ASTM D 257. Breakdown Voltage, Minimum Normal: 5000; Test Method — ASTM D 149. Moist: 2500; Test Method — ASTM D 149. Dielectric Constant 1000 Cups (Hz): 5.5; Test Method — ASTM D 150. Continuous Use Temp. °C: –60 to +180. Thermal Conductance W/m-k: 0.7. Thermal Vacuum Weight Loss Percent (TML) Maximum As Manufactured: 0.40; Test Method — NASA. Thermal Vacuum Weight Loss Percent (TML) Maximum Post Cure 24 Hrs @ 400°F: 0.25; Test method — SP-R-0022A. Volatile Condensable Material, Percent, Maximum (CVCM) as Manufactured: 0.11; Test Method — NASA. Volatile Condensable Material, Percent, Maximum (CVCM) Post Cure 24 Hrs. @ 400°F: 0.07; Test Method — SP-R-0022A. Hardness, Shore A: 85; Test Method — ASTM D 2240. Specific Gravity: 2.0-2.1. Thickness (Expressed In Inches): 0.009 (+0.002, –0.001). Thermal Resistance (TO-3 Transistor) °C/Watt: 0.50.