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Molex Incorporated 70553-0002

Molex Incorporated - 70553-0002 - Header;  2.54mm Pitch;  SL;  Low file;  1-Row;  Rt Angle;  Shroud;  3 Cir;  Gold(38);  Tin PC Tail View larger image View larger image
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Molex Incorporated Header; 2.54mm Pitch; SL; Low file; 1-Row; Rt Angle; Shroud; 3 Cir; Gold(38); Tin PC Tail
Mfr. Part#:
70553-0002

Allied Stock#: 70091078

 RoHS Compliant Part

 
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Pricing (USD) & Availability
Standard Pricing
$1.18 (Each)
1$1.181
50$1.110
100$1.028
250$0.933
1000$0.803
2000$0.673
Availability

174 can ship immediately.

162 on order.

Request Lead Time

Minimum Quantity: 1 |  Multiples Of: 1

Specifications

Agency Approvals: CSA, UL
Alternate Mfr Part Number: 70553-0002
Angle: Right Angle
Brand/Series: SL Series
Color: Black
Contact Plating: Gold
Current Rating: 3 A
Flammability Rating: UL94V-0
Length, Overall: 0.535 "
Length, Pin: 0.13 "
Material, Contact: Copper Alloy
Material, Housing: Polyester
Mounting Hole Size: 0.043 "
Number of Circuits: 3
Number of Contacts: 3
Number of Rows: 1
Orientation: Right Angle
Pin Spacing: 0.1 "
Primary Type: Wire-to-Board
Special Features: Not Low-Halogen
Strain Relief: Low Profile
Temperature, Operating: -40 to +105 °C
Termination: Thru-Hole
Type: Plug
Voltage Rating: 250 V

Overview

SL Modular Connectors Leading the consumer electronics and automotive industries with the largest number of variations and cabling configurations, SL Modular Connectors and Assemblies are ideal for low-power and signal wire-to-board and wire-to-wire applications.

The comprehensive SL (Stackable Linear) Modular Connector System includes: press-fit compliant-pin, low-profile, latching vertical and right-angle headers; five stackable, low-profile housings for male or female crimp terminals; pre-assembled, single-piece pin and receptacle connector assemblies for IDT termination of discrete wire or ribbon cable and piercing crimp termination of FFC/FPC; single- and dual-row latching interim clips for stacking of subassemblies to form larger connectors; and panel mounts for modular wire-to-wire remote interconnections. SL products are capable of mating with select C-Grid and KK products. This product family is suitable for low-power signal applications such as computers, medical instruments, and automotive controls.


Features:
  • Current: 3.0A max. (Discrete Wire), 2.0A max. (FFC/FPC)
  • Voltage: 250V
  • Contact Resistance: 15 Milliohms
  • Dielelctric Withstanding Voltage:
  • 1500V AC for 1 Minute
  • Insulation Resistance: 1,000 Megohms
  • Connector Retention: 45N max. When Latch Engaged, 15N min. With Latch Disengaged
  • Maximum Wire Diameter: 1.63mm (22 to 24 AWG Terminal), 1.52mm (24 to 30 AWG Terminal)
  • Operating Temperature: - 40 to 105°C
  • Solder Temperature: 260°C (Through-hole Wave Solder), 245°C (IR Reflow SMT and Through-hole Paste)