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Molex Incorporated 14-45-1813

Molex Incorporated - 14-45-1813 - IDC Assem;  2.54mm Pitch;  SL;  Male;  1-Row;  Ver D;  Back Ribs;  28 AWG;  Tin (3.81);  13 Cir. View larger image View larger image
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Molex Incorporated IDC Assem; 2.54mm Pitch; SL; Male; 1-Row; Ver D; Back Ribs; 28 AWG; Tin (3.81); 13 Cir.
Mfr. Part#:

Allied Stock#: 70770514


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$1.56 (Each)

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Minimum Quantity: 480 |  Multiples Of: 1


Alternate Mfr Part Number: 70475-0432
Brand/Series: SL Series
Number of Circuits: 13
Number of Contacts: 13
Number of Rows: 1
Primary Type: IDC


SL Modular Connectors Leading the consumer electronics and automotive industries with the largest number of variations and cabling configurations, SL Modular Connectors and Assemblies are ideal for low-power and signal wire-to-board and wire-to-wire applications.

The comprehensive SL (Stackable Linear) Modular Connector System includes: press-fit compliant-pin, low-profile, latching vertical and right-angle headers; five stackable, low-profile housings for male or female crimp terminals; pre-assembled, single-piece pin and receptacle connector assemblies for IDT termination of discrete wire or ribbon cable and piercing crimp termination of FFC/FPC; single- and dual-row latching interim clips for stacking of subassemblies to form larger connectors; and panel mounts for modular wire-to-wire remote interconnections. SL products are capable of mating with select C-Grid and KK products. This product family is suitable for low-power signal applications such as computers, medical instruments, and automotive controls.

  • Current: 3.0A max. (Discrete Wire), 2.0A max. (FFC/FPC)
  • Voltage: 250V
  • Contact Resistance: 15 Milliohms
  • Dielelctric Withstanding Voltage:
  • 1500V AC for 1 Minute
  • Insulation Resistance: 1,000 Megohms
  • Connector Retention: 45N max. When Latch Engaged, 15N min. With Latch Disengaged
  • Maximum Wire Diameter: 1.63mm (22 to 24 AWG Terminal), 1.52mm (24 to 30 AWG Terminal)
  • Operating Temperature: - 40 to 105°C
  • Solder Temperature: 260°C (Through-hole Wave Solder), 245°C (IR Reflow SMT and Through-hole Paste)