Aim 8146

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ONE-STEP Underfill 688; 30 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA
Mfr. Part#: 8146
Allied Stock#: 70054304

RoHS Compliant Part

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Datasheet Datasheet

  • Non Cancelable Non Returnable (NCNR) part. Please see Terms of NCNR
  • Drop Ship Only: This item must be shipped from the manufacturer directly to your location.
  • This item cannot be backordered online. Maximum order amount is 0
Pricing (USD) & Availability
Standard Pricing
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Availability

0 can ship immediately.

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Minimum Quantity: 10

Multiples Of: 10

Specifications

Color : Purple
Physical State : Liquid
Series : 8 Series
Special Features : Flows at 120°C — 140°C
Specific Gravity : 1.27 g/cc
Temperature Range : Maximum at 255°C
Time, Setting : Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds

Overview



One-Step Underfill 688 is a non-odorous, low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-Step Underfill 688 does not require flux, it is compatible with no-clean flux residues and provides excellent adhesion. One-Step Underfill 688 can be dispensed directly following solder paste printing, after which components are placed and the entire assembly is reflowed and cured simultaneously in a standard lead-free reflow process. This eliminates the need for a second assembly process and separate cure cycle. The result of this is faster throughput and higher yields that are achieved in one step through excellent capillary action, fast reflow characteristics, and rapid cure speeds. One-Step Underfill 688 may be reworked at 120°C and the viscosity of the product remains stable through out its shelf life. This product wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces.
Features

  • Excellent Capillary Function for Fast Reflow
  • Compatible with No-Clean Flux Residues
  • Odorless During Printing and Curing
  • Flux Action to Make Solder Connections
  • Non-Hygroscopic
  • Reworkable
  • Good Storage Properties
  • No Voiding
  • Cures in Lead-Free Profile

  • Product Added to Cart
    Aim
    ONE-STEP Underfill 688; 30 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA
    Allied Stock #: 70054304
    Mfr's Part #: 8146
    $32.320 Each
    Quantity added: