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Boyd 159900F00000G

Chemical,Adhesive,Potting Compound,Wt 1qt.,High Performance,Temp -60 to +155degc

Mfr. Part #: 159900F00000G / RS Stock #: 70115241

Boyd

Boyd 159900F00000G

Mfr. Part #: 159900F00000G
RS Stock #: 70115241

Description

Chemical,Adhesive,Potting Compound,Wt 1qt.,High Performance,Temp -60 to +155degc

Out of Stock (Can Be Backordered)

Price

Qty.

Standard Price

1

$608.10

Additional Inventory

On order:

3

Minimum Qty: 1
Multiples Of: 1
Unit Price:
$

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Product Specifications

Product Attribute
Attribute Value
Application
Metal, Glass, Ceramics, Plastics
Chemical Component
Butyl Glycidyl Ether ; Epoxy Resin
Color
Black
Dispensing Method
Can
Physical State
Liquid
Primary Type
Adhesive
Product Header
Ther-O-Bond 1500 Adhesive
Quantity
1
Size
1 qt
Special Features
High Performance
Specific Gravity
1.50
Temperature Rating
-60 to +155 C
Temperature, Rating
-60 to 155 °C
Type
Interface Materials
Volume
1 qt
Weight
1 qt

Overview

Ther-O-Bond 1500 is a versatile epoxy casting system developed for high performance, production potting and encapsulating applications where low shrinkage and rapid air evacuation are required. This formulation has a very low surface tension and a flowable viscosity, which affords excellent air release. Ther-O-Bond 1500 adheres to rigid plastics and laminates, metals and ceramics, has a low coefficient of thermal expansion and is readily machined and shaped with ordinary shop tools. Black in color, the fully cured epoxy system is an excellent electrical insulator which provides good resistance to electrolysis, leakage and corrosion from water, weather, gases and chemical compounds.