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3M DP-270-BLACK

Adhesive, Epoxy Potting Compound, Black, 1.7 fl.Oz.

Mfr. Part #: DP-270-BLACK / RS Stock #: 70113956

3M

3M DP-270-BLACK

Mfr. Part #: DP-270-BLACK
RS Stock #: 70113956

Description

Adhesive, Epoxy Potting Compound, Black, 1.7 fl.Oz.

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$22.73

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$21.60

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$20.19

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Product Specifications

Product Attribute
Attribute Value
Alternate Mfr Part Number
00021200822629
Chemical Component
Carbon Black ; Epoxy Resin ; Hydrocarbon Resin
Chemical System
Epoxy Potting Compound
Color
Black
Dispensing Method
Syringe
Primary Type
Adhesive
Product Header
Scotch-Weld™ Epoxy Potting Compound/Adhesive
Series
DP Series
Setting Time
15 min. (Aluminum), 10 min. (Steel) min
Special Features
Non-Corrosive
Type
Potting Compound
Volume
1.7 oz (48.2g) V
Weight
1.7 fl/oz

Overview

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity

The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable, lightweight EPX applicator. For dispensing, a slight squeeze on the trigger advances the plunger into the cartridge. You're assured of accurate measurement and the mixing nozzle provides thorough mixing and precise placement of material. It's the ideal system for assembly, maintenance and in-field service. Now to meet the specialized needs of the electronics industry, 3M offers three unique new two-part epoxy formulations in Duo-Pak cartridges. These Scotch-Weld products are electrolytically noncorrosive to copper — a vital consideration where long-term reliability of electronic components is a factor.
3M™ Scotch-Weld™ epoxy potting compound/adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting compound/adhesive DP270 is noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions.