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Teledyne Relays GRF180-5

Reserved for Harbor Electronics

Mfr. Part #: GRF180-5 / RS Stock #: 70020648

Teledyne Relays

Teledyne Relays GRF180-5

Mfr. Part #: GRF180-5
RS Stock #: 70020648

Description

Reserved for Harbor Electronics

Out of Stock

Price

Qty.

Standard Price

25

$57.32

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Product Specifications

Product Attribute
Attribute Value
Series
GRF180 Series

Overview

The Series GRF180 relay is the first hermetically sealed,
ultraminiature RF relay designed from inception for surface
mount applications. This magnetic-latching relay features
extremely low internal circuit losses for exceptional time and
frequency domain response characteristics through and
beyond the UHF spectrum and into the S band. The GRF180
features a unique ground shield that isolates and shields
each lead to ensure excellent contact-to-contact and pole-topole
isolation. This ground shield provides a ground interface
that results in improved high-frequency performance as well
as parametric repeatability. The GRF180 extends
performance advantages over similar RF devices that simply
offer formed leads for surface mounting.
The GRF180 is robust to shock, vibration and temperature
extremes for use in space applications and other demanding
environments. It is engineered for use in RF attenuators, RF
switch matrices, automated test equipment, spacecraft and
other applications that require dependable high-frequency
signal fidelity and performance. Its low profile and .100" grid
spaced terminals make the GRF180 ideal for applications
where extreme packaging density and/or close PC board
spacing are required.
Unique features and manufacturing techniques include:
  • Positive mounting means to RF ground plane.
  • Unique uniframe design provides high magnetic efficiency
    and mechanical rigidity.
  • High force/mass ratios for resistance to shock and
    vibration.
  • Advanced cleaning techniques provide maximum
    assurance of internal cleanliness.
  • Gold-plated precious metal alloy contacts ensure reliable dc
    and RF signal switching, as well as low and stable insertion
    loss.
  • Robust to high temperature solder reflow environments.