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TE Connectivity 5-104652-4

Socket, Surface Mount, 1.27mm 40 Way 2 Row, AMPMODU 50/50 Grid Series

Mfr. Part #: 5-104652-4 / RS Stock #: 70287947

TE Connectivity

TE Connectivity 5-104652-4

Mfr. Part #: 5-104652-4
RS Stock #: 70287947

Description

Socket, Surface Mount, 1.27mm 40 Way 2 Row, AMPMODU 50/50 Grid Series

Out of Stock (Can Be Backordered)

Price

Qty.

Standard Price

1

$6.44

5

$5.93

10

$5.15

Additional Inventory

  • Non Cancelable Non Returnable (NCNR) part. Please see Terms of NCNR
  • Traceability data (i.e., Date Code, Lot Code) for this item is currently unavailable.
Minimum Qty: 1
Multiples Of: 1
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Product Specifications

Product Attribute
Attribute Value
Alternate Mfr Part Number
5-104652-4
Connector Style
Receptacle
Connector Type
Connector Assembly
Contact Type
Socket
Dimensions
0.19 in H
Family Name
AMPMODU Interconnect System
For Use With
Receptacle Assembly
Housing Color
Black
Housing Material
LCP
Insulation Resistance
5,000 MOhms
Number of Positions
40
Number of Rows
2
Product Type
Connector
Row to Row Spacing
1.27 mm[.05 in] in
Temperature Operating Range
-65 – 105 °C °C

Overview

TE Connectivity AMPMODU 50/50 Grid Series —2.54mm Headers & Board-to-Board Receptacles | AMPMODU Interconnect System:

The AMPMODU 50/50 Grid connector family includes a variety of high density B-to-B and W-to-B connectors with a .050 x .050 (1,27mm x 1,27mm) pitch.

Features:
  • Suitable for high density systems
  • Categorized in three groups: board mount headers, board mount receptacles, and cable to board receptacles
  • Available in double row, vertical or right angle, shrouded, from 10 up to 100 positions
  • Formed from high conductivity copper alloy and selectively plated with gold for higher performance and reliability
  • Housings on all board-mounted assemblies are made of high temperature tolerant materials, all available in SMD technology and incorporate stand-offs for free drainage of flux cleaning solutions
  • Integral latches for positive locking to shrouded mating headers
  • Mechanical hold downs to aid in solder processing
  • Three available board stack heights offer flexibility in mezzanine application architecture