Power Rating Note: The case temperature is used to establish the max. applied power, see Derating Curve. The case temperature measurement is made with a thermocouple contacting the bottom mounting surface of the package (center of heat dissipating surface), the device mounted on
the heat sink with thermal grease. See Mounting Note. Without a Heat Sink when in free air at +25°C the MP Resistors have the following power ratings: MP820 and MP821: 2.25 W; MP2060: 2.50 W.
&tab;&tab;&tab;&tab;&tab;&tab;&tab;&tab;&tab;
The Thermal Design Should Satisfy the Following Equation:
Case Temp. (Tc) + [Thermal Resistance (Rφj-c) × Power Applied (Watts)] < Tmax, considering the full operation temperature range of the application.&tab;&tab;&tab;&tab;&tab;

Mounting Note: Mount on a smooth, clean, and flat heat sink surface with a thermal interface material such as thermal grease. The entire exposed heat dissipating mounting surface (ceramic or metal) must be in contact with the heat sink. When screw mounting use a compression washer which provides a mounting force of 150 to 300 pounds (665 to 1330 N). This will provide sufficient pressure on the package over time and through large temperature variations to maintain the maximum power dissipation capability. Maximum mounting torque to avoid package damage is 8 in.-lbs. (0.9 N-m). If a spring clip is used, a clip force of 8 to 30 pounds (35 to 130 N) is recommended to be applied to the center of the package. The clip should be round or smooth in the contact area to avoid concentrating the load on a small point of the plastic body. Another mounting option is to use a pressure bar method which can achieve a greater mounting force with greater contact area.

For additional technical information please refer to the Caddock Applications Notes for the MP Series available online at www.caddock.com. or contact Caddock Applications Engineering.
Temperature Coefficient:
ΔR taken at +150°C, ref. +25°C&tab;&tab;
0.50 ohm to 1.00 K ohm: -20 to +80 ppm/°C
0.050 ohm to 0.49 ohm: 0 to +200 ppm/°C&tab;&tab;
0.020 ohm to 0.049 ohm: 0 to +300 ppm/°C

Soldering Note: During surface mount soldering the soldering temperature profile must not cause the metal tab of this device to exceed 220°C.


Specifications

Thermal Resistance (Rφj-c): 5.0°C/W

Voltage Rating: 200 Vrms AC

Non-Inductive Design

DWV: 1500 Vrms AC, the Resistor Element Is Isolated from the Metal Tab and Mounting Surface