The Best Choice for Lead-Free Wave Soldering
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy.

Features:

Does Not Contain Silver or Bismuth

Eutectic Alloy

Bridge-Free and Icicle-Free Soldering

Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate

Good Through-Hole Penetration

Good Topside Fillet Formation

Dross Rate Equal or Lower Than Tin-Lead Solder

Does Not Require a Nitrogen Atmosphere

Does Not Erode Copper from Holes, Pads and Tracks

Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath

Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys

Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead

Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface

Also, Performs Well in Selective and Dip Soldering