Kester Solder 83-1000-0186
Flux-Pen,Mildly Activated Rosin,Copper,No Clean,For Use in Critical Applications
Mfr. Part #: 83-1000-0186 / RS Stock #: 70177933
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Price
Qty.
Standard Price
1
$12.29
5
$11.80
10
$11.55
25
$11.31
50
$11.06
Additional Inventory
On order:
100
Manufacturer Lead Time:
7 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Application
For use in critical applications
Dispensing Method
Flux Pen
Material
Copper
Physical State
Liquid
Specific Gravity
0.879
Type
No-Clean
Volume
0.33 oz
Overview
186 Flux Pen®, Copper Material
Kester Flux-Pen® is a unique tool for rework and touch-up soldering. It allows controlled application of flux, eliminating the mess from flux bottles. The chisel point allows for work in very confined spaces. The flux pen is ideally suited for tab assembly no-clean and surface mount rework application because it can deliver flux to a specific area.
Kester 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for soldering multi-layer assemblies which require higher temperatures.
Kester Flux-Pen® is a unique tool for rework and touch-up soldering. It allows controlled application of flux, eliminating the mess from flux bottles. The chisel point allows for work in very confined spaces. The flux pen is ideally suited for tab assembly no-clean and surface mount rework application because it can deliver flux to a specific area.
Kester 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for soldering multi-layer assemblies which require higher temperatures.
