Ohmite® introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-247 packages (TO-220 and TO-264 available). This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convention cooling.
Features
Minimum assembly cost and labor Spring Clips make the mounting holes, fasteners, tools and fixtures obsolete in assembly operations and reduce costs.
Maximum Thermal Transfer Maximum surface area per unit volume, efficient cooling fins and consistent mounting force reduces thermal resistance.
Maximum Repeatability Constant spring force over repeated assembly/disassembly.
Maximum Reliability Resilient spring action locks electronic component in place. Fewer parts in assembly and no fasteners and washers required. Prevent short circuit by eliminating metal particles generated from hardware or thread tapping.
Design Flexibility Maximum flexibility for dynamic device locations and power upgrading. "Configure-to-Fit" gives designers total freedom to configure heat sink needed to fit into a multitude design environments.