Molex Incorporated 90130-3212
12 way dual row r/a friction lock header
Mfr. Part #: 90130-3212 / RS Stock #: 70372872
Image may be a representation. See specs for product details.
Price
Qty.
Standard Price
5
$3.39
25
$3.12
50
$2.71
100
$2.38
250
$2.03
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Alternate Mfr Part Number
901303212
Application
Signal ; Wire-to-Board
Color
Black
Current Rating
3 A
Family Name
C-Grid III
Number of Circuits
12
Number of Contacts
12
Number of Rows
2
Orientation
Right Angle
Pitch
2.54 mm
Plating Material
Gold
Primary Type
Board Mount
Special Features
Not Low-Halogen
Termination
Through Hole
Type
Right Angle Header
Overview
C-Grid III™
Post and receptacle interconnection system offering complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The 3rd generation C-Grid III 2.54mm pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54mm interconnection system offering unique design features:
Surface Treatment: C-Grid III is available in 3 standard platings. Two performance levels of selective Gold and one of Tin, all over a Nickel-plated substrate, guarantee the optimum ration of quality versus cost of your application.
Flexibility: C-Grid III has been developed to meet the latest industry requirements. Three different termination techniques, solder tail, crimp, and insulation displacement, are combined in a complete interconnection system which is based on north/south contact orientation. Headers will accept both discrete wire and ribbon cable connectors.
Advantage by Design: C-Grid III box contact design employs the same mating concept with all termination techniques. A uniform locking system on all contacts allows full interchangeability inside different housing styles.
Interchangeability: C-Grid III is fully compatible with the industry standard DIN41651 as well as the French norm HE-13/14. Moreover, it is fully intermateable/interchangeable with Molex's QF-50 product range.
Lower Applied Cost: C-Grid III system incorporates a wide range of advanced application tooling, from manually-operated hand tools to semi-automatic harness making machines. C-Grid III offers the widest range of interconnection packaging alternatives in the electric market today.
Post and receptacle interconnection system offering complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The 3rd generation C-Grid III 2.54mm pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54mm interconnection system offering unique design features:
Surface Treatment: C-Grid III is available in 3 standard platings. Two performance levels of selective Gold and one of Tin, all over a Nickel-plated substrate, guarantee the optimum ration of quality versus cost of your application.
Flexibility: C-Grid III has been developed to meet the latest industry requirements. Three different termination techniques, solder tail, crimp, and insulation displacement, are combined in a complete interconnection system which is based on north/south contact orientation. Headers will accept both discrete wire and ribbon cable connectors.
Advantage by Design: C-Grid III box contact design employs the same mating concept with all termination techniques. A uniform locking system on all contacts allows full interchangeability inside different housing styles.
Interchangeability: C-Grid III is fully compatible with the industry standard DIN41651 as well as the French norm HE-13/14. Moreover, it is fully intermateable/interchangeable with Molex's QF-50 product range.
Lower Applied Cost: C-Grid III system incorporates a wide range of advanced application tooling, from manually-operated hand tools to semi-automatic harness making machines. C-Grid III offers the widest range of interconnection packaging alternatives in the electric market today.
