Molex Incorporated 73252-0090
2.92MM JACK,PCB,50 OHM,FIELD REPLACEABLE; 73252
Mfr. Part #: 73252-0090 / RS Stock #: 70714397
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Price
Qty.
Standard Price
1
$35.36
5
$32.53
10
$29.52
Additional Inventory
Can ship in 10 days:
2551
Manufacturer Lead Time:
7 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Product Specifications
Product Attribute
Attribute Value
Search
Alternate Mfr Part Number
732520090
Angle
Straight Degree(s)
Impedance
50 ohm
Mounting Type
PCB Mount
Orientation
Straight
Primary Type
SMA
Special Features
Low-Halogen
Type
Subminiature
Overview
Precision Compression-Mount Microwave Test Connectors
Providing the digital testing industry’s only solderless vertical PCB launch configuration, Molex’s innovative Precision Compression-Mount Microwave Test Connectors optimize design flexibility and reduce installation time while achieving up to 65 GHz analog performance over 20 Gbps. Until now, traditional test methods have required timely soldering and a limited number of test ports per board. Precision Compression-Mount Microwave Test Connectors offer a more streamlined solution with a vertical mount design for placement anywhere on the PCB, enabling more test connectors to be placed around parts being tested. The compression-mount design also reduces installation time and costs by eliminating soldering from the process.
Providing the digital testing industry’s only solderless vertical PCB launch configuration, Molex’s innovative Precision Compression-Mount Microwave Test Connectors optimize design flexibility and reduce installation time while achieving up to 65 GHz analog performance over 20 Gbps. Until now, traditional test methods have required timely soldering and a limited number of test ports per board. Precision Compression-Mount Microwave Test Connectors offer a more streamlined solution with a vertical mount design for placement anywhere on the PCB, enabling more test connectors to be placed around parts being tested. The compression-mount design also reduces installation time and costs by eliminating soldering from the process.