Molex Incorporated 43650-0324
Header, Single Row, Vertical, Solder Tab, 3 Circuits, SMT, Glow Wire, Tin Plate
Mfr. Part #: 43650-0324 / RS Stock #: 70091006
Price
Qty.
Standard Price
1800
$2.84
9000
$2.61
18000
$2.27
36000
$1.99
90000
$1.70
Additional Inventory
Can ship in 10 days:
5000
Manufacturer Lead Time:
10 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Alternate Mfr Part Number
43650-0324
Color
Black
Current Rating
8.5 A
Family Name
Micro-Fit 3.0
Number of Circuits
3
Number of Contacts
3
Number of Rows
1
Orientation
Vertical
Pitch
3.00 mm (0.118”) in
Plating Material
Tin
Primary Type
Soft Shell
Special Features
Low-Halogen
Termination
Surface Mount
Type
Vertical Header
Overview
Micro-Fit 3.0™ Connectors
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
