Molex Incorporated 43645-0800
MICRO-FIT 3.0 Series 3mm Pitch 8Way 1 Row Female Straight PCB Conn Housing 43645
Mfr. Part #: 43645-0800 / RS Stock #: 70090641
Price
Qty.
Standard Price
1
$0.50
10
$0.425
25
$0.39
50
$0.36
100
$0.335
500
$0.31
Additional Inventory
Can ship in 10 days:
3695
Manufacturer Lead Time:
9 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Agency Approvals
CSA ; UL ; TUV
Alternate Mfr Part Number
436450800
Angle
Straight Degree(s)
Color
Black
Family Name
Micro-Fit 3.0
Gender
Receptacle
Housing Material
Polyester
Number of Circuits
8
Number of Contacts
8
Number of Rows
1
Operating Temperature
-40 to 105 °C
Pin Spacing
0.118 ”
Pitch
3.00 mm (0.118”) in
Primary Type
Soft Shell
Product Header
Micro-Fit 3.0™ Wire-to-Wire Socket Housing
Special Features
Not Low-Halogen
Type
Socket Housing
Overview
Micro-Fit 3.0™ Connectors
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
