Molex Incorporated 43045-1412
Micro Fit 3.0 Vertical Header, 3mm Pitch, Dual Row, 14 Circuits,PCB
Mfr. Part #: 43045-1412 / RS Stock #: 70090949
Price
Qty.
Standard Price
1
$0.99
Additional Inventory
Manufacturer Lead Time:
10 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Agency Approvals
CSA ; UL ; TUV
Alternate Mfr Part Number
43045-1412
Angle
Vertical Degree(s)
Application
Wire-to-Board
Color
Black
Current Rating
8.5 A
Family Name
Micro-Fit 3.0
Gender
Male
Housing Material
Polyester
Number of Circuits
14
Number of Contacts
14
Number of Rows
2
Operating Temperature
-40 to 105 °C
Orientation
Vertical
Overall Length
0.551 "
Pin Spacing
0.118 ”
Pitch
3.00 mm (0.118”) in
Plating Material
Tin
Primary Type
Soft Shell
Product Header
Micro-Fit 3.0™ Wire-to-Board Vertical Header
Special Features
Low-Halogen
Standards
UL Listed, CSA Certified, TUV Approved
Temperature Range
-40 to 105 C
Termination
Through Hole
Type
Vertical Header
UPC Code
800754373661
Overview
Micro-Fit 3.0™ Connectors
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
