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Molex Incorporated 16-02-0103

Molex Incorporated - 16-02-0103 - Contact;  Socket;  Crimp;  24-22 AWG;  SL;  Gold Plate (15);  70058 Series;  Bag View larger image View larger image
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Molex Incorporated Contact; Socket; Crimp; 24-22 AWG; SL; Gold Plate (15); 70058 Series; Bag
Mfr. Part#:
16-02-0103

Allied Stock#: 70190643

 RoHS Compliant Part

 
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Pricing (USD) & Availability
Standard Pricing
$0.095 (Each)
1$0.095
50$0.090
100$0.083
250$0.074
Availability

46570 can ship immediately.

Request Lead Time

Minimum Quantity: 1 |  Multiples Of: 1

Specifications

Alternate Mfr Part Number: 70058-0224
Brand/Series: SL Series
Contact Mating Area Plating: Gold
Contact Type: Socket
Primary Type: Rectangular
Special Features: Low-Halogen
Type: Contact
Wire Size: 24-22

Overview

SL Modular Connectors Leading the consumer electronics and automotive industries with the largest number of variations and cabling configurations, SL Modular Connectors and Assemblies are ideal for low-power and signal wire-to-board and wire-to-wire applications.

The comprehensive SL (Stackable Linear) Modular Connector System includes: press-fit compliant-pin, low-profile, latching vertical and right-angle headers; five stackable, low-profile housings for male or female crimp terminals; pre-assembled, single-piece pin and receptacle connector assemblies for IDT termination of discrete wire or ribbon cable and piercing crimp termination of FFC/FPC; single- and dual-row latching interim clips for stacking of subassemblies to form larger connectors; and panel mounts for modular wire-to-wire remote interconnections. SL products are capable of mating with select C-Grid and KK products. This product family is suitable for low-power signal applications such as computers, medical instruments, and automotive controls.


Features:
  • Current: 3.0A max. (Discrete Wire), 2.0A max. (FFC/FPC)
  • Voltage: 250V
  • Contact Resistance: 15 Milliohms
  • Dielelctric Withstanding Voltage:
  • 1500V AC for 1 Minute
  • Insulation Resistance: 1,000 Megohms
  • Connector Retention: 45N max. When Latch Engaged, 15N min. With Latch Disengaged
  • Maximum Wire Diameter: 1.63mm (22 to 24 AWG Terminal), 1.52mm (24 to 30 AWG Terminal)
  • Operating Temperature: - 40 to 105°C
  • Solder Temperature: 260°C (Through-hole Wave Solder), 245°C (IR Reflow SMT and Through-hole Paste)