Increased Surface Areas By 3X
Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (patent pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. These rods (or "rollers") are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO–252, TO–263 and TO–268 packages, the D Series gives the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal bottleneck is also eliminated, while surface area for cooling is maximized with the extruded fins of the D Series body.