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Easiest Assembly, Largest Surface Area & Smallest Footprint
Ohmite introduces the M series: high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO–247 and TO–264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.
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Features- Minimum assembly cost and labor: spring clips make the mounting holes and fasteners obsolete
- Maximum thermal transfer: maximum surface area per unit volume, efficient cooling fins & consistent mounting force
- Maximum repeatability: constant spring force over repeated assembly⁄disassembly
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