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International Rectifier IRF3710SPBF

International Rectifier - IRF3710SPBF - MOSFET,  Power; N-Ch; VDSS 100V; RDS(ON) 23Milliohms; ID 57A; D2Pak; PD 200W; VGS +/-20 View larger image View larger image
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International Rectifier MOSFET, Power; N-Ch; VDSS 100V; RDS(ON) 23Milliohms; ID 57A; D2Pak; PD 200W; VGS +/-20
Mfr. Part#:
IRF3710SPBF

Allied Stock#: 70016956

 RoHS Compliant Part

 
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  • For additional quantity inquiries, please contact your local sales office.
  • This item may not be backordered online. Maximum order amount is 72.
Pricing (USD) & Availability
Standard Pricing
$3.04 (Each)
1$3.037
10$1.610
100$1.426
500$1.334
1000$1.277
2500$1.219
5000$1.173
Availability

72 can ship immediately.

Request Lead Time

Minimum Quantity: 1 |  Multiples Of: 1

Specifications

Brand/Series: HEXFET Series
Capacitance, Input: 3130 pF @ 25 V
Channel Mode: Enhancement
Channel Type: N
Configuration: Dual Drain
Current, Drain: 57 A
Dimensions: 10.67 x 9.65 x 4.83 mm
Gate Charge, Total: 130 nC
Height: 4.83 mm
Length: 10.67 mm
Mounting Type: Surface Mount
Number of Elements per Chip: 1
Number of Pins: 3
Package Type: D2PAK
Polarization: N-Channel
Power Dissipation: 200 W
Resistance, Drain to Source On: 23
Temperature, Operating, Maximum: +175 °C
Temperature, Operating, Minimum: -55 °C
Temperature, Operating, Range: -55 to +175 °C
Time, Turn-Off Delay: 45 ns
Time, Turn-On Delay: 12 ns
Transconductance, Forward: 32 S
Typical Gate Charge @ Vgs: Maximum of 130 nC @ 10 V
Voltage, Breakdown, Drain to Source: 100 V
Voltage, Drain to Source: 100 V
Voltage, Forward, Diode: 1.2 V
Voltage, Gate to Source: ±20 V
Width: 0.38" (9.65mm)

Overview

Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (IRF3710L) is available for low-profile applications.

Features:
  • Advanced Process Technology
  • Ultra Low On-Resistance
  • Dynamic dv/dt Rating
  • 175°C Operating Temperature
  • Fast Switching
  • Fully Avalanche Rated
  • Lead-Free